Harbin Yisheng New Materials has announced a nearly RMB100 million Series A3 financing round, according to Pedaily/Zero2IPO and 36Kr. The reported new capital brings a less visible part of high-power electronics into focus: the material that carries heat away from the places where it accumulates fastest.
CanSemi Technology Inc. has moved from a private semiconductor buildout to a public-market test. The specialty foundry listed on Shenzhen’s ChiNext board on October 13 under code 301660, and the stock closed its first session at CNY38.80, according to Beijing News, 223.06% above its CNY12.01 offer price.
ModelBest’s MiniCPM-V 4.7 asks a practical question that matters more than a large parameter label: what must a phone give up to run a capable multimodal model locally? The October 12 release pairs a dense 1B model with a 35B-A3B mixture-of-experts option that can handle images, multiple images, documents, and video.
Alibaba is putting a more demanding version of the personal-assistant promise in front of Qwen App users. Qwen Go, presented on Qwen’s official web application as a personal assistant, is being offered through a limited free experience with an application or waiting-list prompt. That status matters.
A route before a retail product XPENG has put a Europe-specific destination on the timetable for its IRON humanoid robot: the company is targeting the second half of 2027 for the region. That matters because it gives the Chinese electric-vehicle maker a more concrete overseas robotics route than its earlier broad 2027 ambitions.
ByteDance’s Seed research group has given model safety a distinct internal home, a move that changes who is responsible for some of the hardest questions around frontier models.
BlueCore Computing, a Shenzhen designer of RISC-V server CPUs, has reportedly completed a Series B financing of nearly RMB2 billion.
Astribot has reportedly completed a new CNY1 billion financing round, adding money to a Shenzhen robotics effort that spans models, an embodied operating system, and a cable-driven robot body.
DeepSeek is reportedly preparing a second external financing whose proposed size has grown from RMB50 billion to about RMB100 billion, even as the transaction remains open. People involved in the deal told a Caijing report republished by 21st Century Business Herald that they expected it to close soon.
Reuters, citing an IDC study of China’s data-center AI-accelerator shipments in the first half of 2026, found Nvidia still in front but Huawei much closer behind. IDC put Nvidia at 34% of that market, or 678,000 accelerators, while Huawei held 28%, or 572,000.
